Invention Grant
- Patent Title: Module assembly
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Application No.: US15146340Application Date: 2016-05-04
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Publication No.: US09755356B1Publication Date: 2017-09-05
- Inventor: Seok Jung Kim , Yoon Son , Sang Hun Oh
- Applicant: LUXROBO
- Applicant Address: KR Seoul
- Assignee: LUXROBO
- Current Assignee: LUXROBO
- Current Assignee Address: KR Seoul
- Agency: Dinsmore & Shohl LLP
- Agent Yongsok Choi
- Priority: KR10-2016-0027233 20160307
- Main IPC: H01R11/30
- IPC: H01R11/30 ; H01R13/60 ; H01R13/62

Abstract:
Provided is a module assembly including a plurality of modules. The modules each include a polyhedral housing with a polygonal plane, a pin provided on one side of a corner of the housing to selectively protrude, a pin installation portion in which the pin is installed to be movable, a pin receiver provided on another side of the corner of the housing such that a pin of another module is to be inserted thereinto, and a magnet installed between the pin installation portion and the pin receiver, and configured to apply magnetic force to both the pin provided in the pin installation portion and the pin of the other module to be received in the pin receiver.
Public/Granted literature
- US20170256884A1 MODULE ASSEMBLY Public/Granted day:2017-09-07
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