An electronic, optoelectronic or electric arrangement contains a circuit carrier having a metallic heat conductor, and a component, which is embedded, inserted or formed in the circuit carrier. The component has at least one electric, electronic or optoelectronic construction element and a rewiring layer, which contains a metallic heat conducting path. A metallic-thermal connection of the rewiring layer and the metallic heat conducting layer of the circuit carrier is provided by the heat conducting path.