Invention Grant
- Patent Title: Package for housing electronic component and electronic device
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Application No.: US14758334Application Date: 2014-02-25
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Publication No.: US09756731B2Publication Date: 2017-09-05
- Inventor: Noritaka Niino
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2013-034689 20130225
- International Application: PCT/JP2014/054590 WO 20140225
- International Announcement: WO2014/129666 WO 20140828
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/03 ; H01L23/26 ; H05K1/02 ; H01L23/057
Abstract:
A package for housing an electronic component, which is provided with: a substrate part that comprises an insulating substrate, which is formed of a ceramic sintered body and comprises a recess portion, and a wiring conductor which is provided on the insulating substrate; and a metal portion which is formed of a sintered body of a getter metal material and is directly bonded to the recess portion.
Public/Granted literature
- US20150334845A1 PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE Public/Granted day:2015-11-19
Information query
