A method for manufacturing a printed wiring board includes forming on carrier a laminate including a second metal foil, a resin layer laminated on the second foil and a first metal foil laminated on the resin layer, irradiating laser upon the first foil such that opening is formed through the first foil and resin layer and exposes surface of the second foil at bottom, plating the first foil such that a via conductor is formed in the opening and a first conductor layer including the first foil and an electroplating film is formed on surface of the resin layer, removing the carrier from the laminate, patterning the first conductor layer on the resin layer, and patterning the second foil such that a second conductor layer including the second foil is formed on opposite surface of the resin layer. The second foil has thickness greater than thickness of the first foil.