Invention Grant
- Patent Title: Device for mounting electronic components
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Application No.: US14582881Application Date: 2014-12-24
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Publication No.: US09756770B2Publication Date: 2017-09-05
- Inventor: Kazuyoshi Ohyama , Tsutomu Yanagida , Yoshinori Kano , Seiji Ohnishi , Tetsuji Ono
- Applicant: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
- Applicant Address: JP Shizuoka-ken
- Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee Address: JP Shizuoka-ken
- Agency: Studebaker & Brackett PC
- Priority: JP2012-147278 20120629
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04 ; H05K3/30

Abstract:
A control unit determines whether or not confirmation of a type of a tape processing unit is necessary, and performs identification processing of the type of the tape processing unit when confirmation of the type of the tape processing unit is determined as necessary. Then, this identification processing of the type is performed and the control unit determines whether or not an electronic component handleable by this tape processing unit coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component in a storage tape with an adsorption nozzle when the electronic component is determined as coinciding.
Public/Granted literature
- US20150143693A1 METHOD FOR MOUNTING ELECTRONIC COMPONENT AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT Public/Granted day:2015-05-28
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