Invention Grant
- Patent Title: Die apparatus and manufacturing method of metal product using die apparatus
-
Application No.: US15003093Application Date: 2016-01-21
-
Publication No.: US09757786B2Publication Date: 2017-09-12
- Inventor: Akihiro Hashimoto , Kenichirou Iwata
- Applicant: MITSUI HIGH-TEC, INC.
- Applicant Address: JP Fukuoka
- Assignee: MITSUI HIGH-TEC, INC.
- Current Assignee: MITSUI HIGH-TEC, INC.
- Current Assignee Address: JP Fukuoka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2015-031655 20150220
- Main IPC: B21D28/14
- IPC: B21D28/14 ; B21D28/22 ; H02K15/00
Abstract:
A die apparatus includes a first die and a second die which are respectively used in adjacent working stations that sequentially blank or stamp out a progressively fed thin metal sheet. The first and second dies are held in a state where outer peripheral surfaces of the first and second dies directly contact each other.
Public/Granted literature
- US20160243605A1 DIE APPARATUS AND MANUFACTURING METHOD OF METAL PRODUCT USING DIE APPARATUS Public/Granted day:2016-08-25
Information query
