Invention Grant
- Patent Title: Tire mounting method using a tire mounting device
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Application No.: US14295240Application Date: 2014-06-03
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Publication No.: US09757827B2Publication Date: 2017-09-12
- Inventor: Saeko Komatsu , Yoshito Otake
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2008-019126 20080130; JP2008-019131 20080130; JP2008-022395 20080201; JP2008-174717 20080703; JP2008-174722 20080703; JP2008-174726 20080703
- Main IPC: B23P19/00
- IPC: B23P19/00 ; B23P19/04 ; B23P19/06 ; B25J15/10 ; B62D65/12 ; B23P21/00 ; B62D65/02

Abstract:
A tire mounting method is provided for automatically mounting a tire onto hub bolts of a motor vehicle. The method includes gripping the tire and temporarily tightening nuts on the hub bolts on which the tire has been placed with a first working mechanism. The nuts that have been temporarily tightened by the first working mechanism are fully tightened with a second working mechanism, which is disposed in association with a first mounting region on a front wheel side or on a rear wheel side of the motor vehicle. The nuts that have been temporarily tightened by the first working mechanism are fully tightened with a third working mechanism, which is disposed in association with a second mounting region on the rear wheel side or on the front wheel side of the motor vehicle.
Public/Granted literature
- US20140310933A1 TIRE MOUNTING METHOD Public/Granted day:2014-10-23
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