Invention Grant
- Patent Title: Carrier plate assembly for a wafer
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Application No.: US15448647Application Date: 2017-03-03
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Publication No.: US09757865B1Publication Date: 2017-09-12
- Inventor: Teng-Kuei Chen
- Applicant: Well Thin Technology, Ltd.
- Applicant Address: TW Zhubei
- Assignee: Well Thin Technology, Ltd.
- Current Assignee: Well Thin Technology, Ltd.
- Current Assignee Address: TW Zhubei
- Agency: Kamrath IP Lawfirm, P.A.
- Agent Alan D. Kamrath
- Main IPC: B25J15/06
- IPC: B25J15/06 ; B25J19/00 ; B25J11/00 ; B25J15/00 ; H01L21/687

Abstract:
A carrier plate assembly has a carrier plate and multiple gaskets. The carrier plate has a first end, a second end, and a carrier surface between the first end and the second end. The carrier surface forms multiple accommodating recesses. The gaskets are accommodated in the accommodating recesses. The gaskets prevent the wafer from sliding. Besides, with top surfaces of the gaskets aligning with the carrier surface and an edge of each gasket connected to an edge of an opening of the accommodating recess, the accommodating recess is filled by the gasket, and thus the gasket is securely accommodated in the accommodating recess and may not deform upward.
Public/Granted literature
- US20170259437A1 Carrier Plate Assembly For A Wafer Public/Granted day:2017-09-14
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