Invention Grant
- Patent Title: Microstructure plating systems
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Application No.: US15162027Application Date: 2016-05-23
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Publication No.: US09758364B2Publication Date: 2017-09-12
- Inventor: Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00
Abstract:
Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Public/Granted literature
- US20170001856A1 MICROSTRUCTURE PLATING SYSTEMS AND METHODS Public/Granted day:2017-01-05
Information query
