Invention Grant
- Patent Title: Molding resin composition including chlorinated vinyl chloride-based resin, and molded article thereof
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Application No.: US15292666Application Date: 2016-10-13
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Publication No.: US09758633B2Publication Date: 2017-09-12
- Inventor: Kenichi Matsumura , Atsushi Seiki , Norikazu Mashino , Kei Yoshiyama , Atsushi Kawano
- Applicant: SEKISUI CHEMICAL CO., LTD. , TOKUYAMA SEKISUI CO., LTD.
- Applicant Address: JP Osaka JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.,TOKUYAMA SEKISUI CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.,TOKUYAMA SEKISUI CO., LTD.
- Current Assignee Address: JP Osaka JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-202384 20130927
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08K3/26 ; C08K5/053 ; C08K5/06 ; C08K5/098 ; C08K5/103 ; C08K5/11

Abstract:
The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less. The thermal stabilizer contains at least one of a compound represented by the formula Ca1-xZnx (OH)2 where x satisfies the inequality 0
Public/Granted literature
- US20170029593A1 MOLDING RESIN COMPOSITION INCLUDING CHLORINATED VINYL CHLORIDE-BASED RESIN, AND MOLDED ARTICLE THEREOF Public/Granted day:2017-02-02
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