Invention Grant
- Patent Title: Polishing composition containing cationic polymer additive
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Application No.: US14639598Application Date: 2015-03-05
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Publication No.: US09758697B2Publication Date: 2017-09-12
- Inventor: Brian Reiss , Dana Sauter Van Ness , Viet Lam , Renhe Jia
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Erika S. Wilson; Ashlee B. Szelag
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C03C15/00 ; C03C25/68 ; C09K13/00 ; H01L21/302 ; H01L21/461 ; C09G1/02 ; C09G1/00 ; H01L21/321 ; C23F1/14 ; H01L21/306

Abstract:
The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate, especially a substrate comprising a silicon oxide layer, with the chemical-mechanical polishing compositions. The polishing compositions comprise first abrasive particles, wherein the first abrasive particles are wet-process ceria particles, have a median particle size of about 75 nm to about 200 nm, and are present in the polishing composition at a concentration of about 0.005 wt. % to about 2 wt. % a functionalized heterocycle, a cationic polymer selected from a quaternary amine, is cationic polyvinyl alcohol, and a cationic cellulose, optionally a carboxylic acid, a pH-adjusting agent, and an aqueous carrier, and have a pH of about 1 to about 6.
Public/Granted literature
- US20160257853A1 POLISHING COMPOSITION CONTAINING CATIONIC POLYMER ADDITIVE Public/Granted day:2016-09-08
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