Invention Grant
- Patent Title: Electroplating methods for semiconductor substrates
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Application No.: US14222407Application Date: 2014-03-21
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Publication No.: US09758893B2Publication Date: 2017-09-12
- Inventor: Sam K. Lee , Charles Sharbono
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Perkins Coie LLP
- Agent Kenneth H. Ohriner
- Main IPC: C25D5/48
- IPC: C25D5/48 ; C25D5/02 ; C25D7/12 ; C25F3/02 ; C23C18/16 ; H01L21/768 ; C25F3/16 ; H01L21/288 ; H01L21/321
Abstract:
A non-uniform initial metal film is non-uniformly deplated to provide a more uniform metal film on a substrate. Electrochemical deplating may be performed by placing the substrate in a deplating bath formulated specifically for deplating, rather than for plating. The deplating bath may have a throwing power of 0.3 or less; or a bath conductivity of 1 mS/cm to 250 mS/cm. Reverse electrical current conducted through the deplating bath non-uniformly. electro-etches or deplates the metal film.
Public/Granted literature
- US20150225866A1 ELECTROPLATING METHODS FOR SEMICONDUCTOR SUBSTRATES Public/Granted day:2015-08-13
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