A heat treatment apparatus includes: a plurality of rollers guiding a substrate, each of the rollers having a roller width greater than a substrate width; a heater including a heating surface which has a width greater than the substrate width; and a heat shield member arranged between a heating surface exposed portion of the heating surface, which is exposed while protruding from an end of the substrate in a width direction of the substrate along the width direction and a roller exposed portion of the specific roller included in the plurality of rollers, the roller exposed portion being exposed while protruding from the end of the substrate in the width direction to the same direction in which the heating surface exposed portion protrudes, the heat shield member shielding heat radiation from the heating surface exposed portion to an outer circumferential surface of the roller exposed portion.