Embodiments described herein provide for a sensing device including a sensor die attached to a header. The header has a first working surface composed of a first one or more electrically conductive pads and a bulk of the header. The sensor die has a second working surface and a third surface reverse of the second working surface. The sensor die includes a sensing element on the second working surface, and the third surface of the sensor die is composed of a second one or more electrically conductive pads and a dielectric layer. The first one or more electrically conductive pads of the header contact the second one or more electrically conductive pads of the sensor die, and the bulk of the header at the first working surface of the header contacts the dielectric layer of the third surface of the sensor die.