• Patent Title: Test socket including conductive particles in which through-holes are formed and method for manufacturing same
  • Application No.: US14406882
    Application Date: 2013-06-18
  • Publication No.: US09759742B2
    Publication Date: 2017-09-12
  • Inventor: Jae Hak Lee
  • Applicant: ISC CO., LTD.
  • Applicant Address: KR Seongnam-si, Gyeonggi-do
  • Assignee: ISC CO., LTD.
  • Current Assignee: ISC CO., LTD.
  • Current Assignee Address: KR Seongnam-si, Gyeonggi-do
  • Agency: Harness, Dickey & Pierce, P.L.C.
  • Priority: KR10-2012-0065229 20120618
  • International Application: PCT/KR2013/005344 WO 20130618
  • International Announcement: WO2013/191432 WO 20131227
  • Main IPC: G01R1/04
  • IPC: G01R1/04 H01R13/24 G01R1/073
Test socket including conductive particles in which through-holes are formed and method for manufacturing same
Abstract:
The present invention relates to a test socket that is disposed between a blood test device and a test apparatus to electrically connect a terminal of the blood test device and a pad of the test apparatus with each other. Conduction units that are arranged at positions corresponding to the terminal of the blood test device and show conductivity in a thickness direction have: conduction units that are arranged in such a manner that multiple conductive particles are arranged in the thickness direction in an elastic insulating material; and an insulating support unit that supports and insulates each of the conduction units. The conductive particles are provided with through-holes bored through one surface and another surface other than the one surface, and the through-holes are filled with the elastic insulating material.
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