Invention Grant
- Patent Title: Resistance assembly for mobile device and manufacturing method thereof
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Application No.: US14696246Application Date: 2015-04-24
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Publication No.: US09761355B2Publication Date: 2017-09-12
- Inventor: Jea-Hoon Lee , Woo-Jin Choi , Young-Key Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0050079 20140425
- Main IPC: H01C1/01
- IPC: H01C1/01 ; H01C1/14 ; H01C7/00 ; H01C13/02 ; H01C17/00

Abstract:
A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.
Public/Granted literature
- US20150310970A1 RESISTANCE ASSEMBLY FOR MOBILE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-10-29
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