A cleaning apparatus for a semiconductor substrate includes a belt conveyor, a treatment head that executes cleaning, rinsing and drying treatments, a rinse water supplying mechanism that supplies rinse water adjusted to a predetermined pH value to the treatment head and configured to rinse the substrate applies heat to the rinse water to set a rinse water temperature to 70° or above, and an optical mechanism. The treatment head is configured to rinse the substrate. The optical mechanism is configured to recognize a pattern on the semiconductor substrate so that the semiconductor substrate can be automatically placed on the belt conveyor with a direction of the recognized pattern and a feeding direction of the belt conveyor having a predetermined relationship. The treatment head includes a drying treatment mechanism configured to execute both a drying treatment with use of drying solvent and lamp annealing in execution of drying treatment.