Invention Grant
- Patent Title: Manufacturing line for semiconductor device and method of manufacturing semiconductor device
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Application No.: US14738122Application Date: 2015-06-12
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Publication No.: US09761471B2Publication Date: 2017-09-12
- Inventor: Daisuke Sugizaki
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Toyota-shi
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-124768 20140617
- Main IPC: B65G43/08
- IPC: B65G43/08 ; H01L21/00 ; H01L21/677 ; B65G47/52 ; H01L21/67

Abstract:
A manufacturing line for a semiconductor device according to the invention is a manufacturing line for manufacturing a semiconductor device by circulating a workpiece along a conveyance route on which a plurality of treatment devices are arranged. The conveyance route includes a first route on which the treatment devices with a large number of times of treatment are arranged, and a second route on which the treatment devices with a small number of times of treatment are arranged. Besides, the conveyance route makes a changeover between the conveyance of the workpiece that has moved along the first route to the first route in a continuous manner, and the conveyance of the workpiece that has moved along the first route to the second route.
Public/Granted literature
- US20150364353A1 MANUFACTURING LINE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2015-12-17
Information query
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