Invention Grant
- Patent Title: Semiconductor structure and method of forming the same
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Application No.: US13465885Application Date: 2012-05-07
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Publication No.: US09761494B2Publication Date: 2017-09-12
- Inventor: Po-Yu Chen , Wan-Hua Huang , Jing-Ying Chen , Kuo-Ming Wu
- Applicant: Po-Yu Chen , Wan-Hua Huang , Jing-Ying Chen , Kuo-Ming Wu
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/78 ; H01L29/06 ; H01L21/768

Abstract:
A semiconductor structure includes a gate structure disposed on a substrate. At least one lightly doped region adjoins the gate structure in the substrate. The at least one lightly doped region has a first conductivity type. A source feature and a drain feature are on opposite sides of the gate structure in the substrate. The source feature and the drain feature have the first conductivity type. The source feature is in the at least one lightly doped region. A bulk pick-up region adjoins the source feature in the at least one lightly doped region. The bulk pick-up region has a second conductivity type.
Public/Granted literature
- US20130292781A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2013-11-07
Information query
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