Invention Grant
- Patent Title: Power semiconductor module and composite module
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Application No.: US15150938Application Date: 2016-05-10
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Publication No.: US09761567B2Publication Date: 2017-09-12
- Inventor: Motohito Hori , Yoshinari Ikeda
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agent Manabu Kanesaka
- Priority: JP2014-101423 20140515
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/22 ; H01L23/48 ; H01L23/52 ; H01L23/06 ; H01L23/29 ; H01L25/11 ; H01L25/07 ; H01L25/18 ; H01L23/049 ; H01L23/16 ; H01L23/31 ; H01L23/40 ; H01L23/492 ; H01L23/498 ; H01L23/538 ; H01L23/053 ; H01L23/367 ; H01L23/00 ; H01L23/15 ; H01L23/373 ; H01L23/24
Abstract:
A power semiconductor module includes a wiring member that electrically connects a front surface electrode of a semiconductor element and a circuit board of an insulating substrate in a housing. A resin provided in the housing covers the wiring member, and has a height in the vicinity of the wiring member. A cover covering the periphery of external terminals is provided between the resin and a first lid in the housing. A second lid is provided further outside the first lid in an aperture portion of the housing, and the space between the second lid and the first lid is filled with another resin.
Public/Granted literature
- US20160254255A1 POWER SEMICONDUCTOR MODULE AND COMPOSITE MODULE Public/Granted day:2016-09-01
Information query
IPC分类:
