Invention Grant
- Patent Title: Solid-state imaging apparatus, method for manufacturing the same, and imaging system
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Application No.: US14489812Application Date: 2014-09-18
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Publication No.: US09761618B2Publication Date: 2017-09-12
- Inventor: Takashi Moriyama , Masaaki Minowa , Takeshi Ichikawa , Masahiro Ogawa
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2013-210588 20131007
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/265 ; H04N5/232 ; H04N5/33 ; H04N5/374

Abstract:
A solid-state imaging apparatus, comprising a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method, a second semiconductor region of the first conductivity type provided on the first semiconductor region, and a third semiconductor region of a second conductivity type provided in the second semiconductor region so as to form a pn junction with the second semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration decreases from a side of the substrate to a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.
Public/Granted literature
- US20160027825A1 SOLID-STATE IMAGING APPARATUS, METHOD FOR MANUFACTURING THE SAME, AND IMAGING SYSTEM Public/Granted day:2016-01-28
Information query
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