Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15148612Application Date: 2016-05-06
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Publication No.: US09761668B2Publication Date: 2017-09-12
- Inventor: Daisuke Ichikawa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2015-095988 20150508; JP2016-086419 20160422
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/78 ; H01L29/08 ; H01L29/06 ; H01L29/40 ; H01L29/423

Abstract:
A semiconductor device includes a first conductivity type semiconductor substrate, a second conductivity type semiconductor layer which is formed on the semiconductor substrate so as to be in contact with the semiconductor substrate, a first conductivity type body region which is formed in a front surface portion of the semiconductor layer, a second conductivity type source region which is formed in a front surface portion of the body region, a second conductivity type drain region which is formed apart from the body region, a gate insulating film which is formed in a front surface of the semiconductor layer so as to be in contact with the body region, a thick insulating film which is formed integrally with the gate insulating film so as to cover the semiconductor layer between the gate insulating film and the drain region and a gate electrode which is opposite to the body region via the gate insulating film. The body region includes a first portion in which a boundary with the semiconductor layer is in contact with the gate insulating film and a second portion in which a boundary with the semiconductor layer is in contact with the thick insulating film.
Public/Granted literature
- US20160329425A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-11-10
Information query
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