Invention Grant
- Patent Title: Jack socket and electronic device
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Application No.: US14541691Application Date: 2014-11-14
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Publication No.: US09761970B2Publication Date: 2017-09-12
- Inventor: Koichi Izawa , Kiyohito Masuda
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01R24/04
- IPC: H01R24/04 ; H01R12/70 ; H01R12/72 ; H01R24/58 ; H01R13/46

Abstract:
A housing is configured to receive a plug that includes an upper face, a lower face, and a front face. The housing also includes a cutout portion that traverses the upper face and the lower face, opens to the front face of the housing, extends for a length of the plug, and is formed in a direction of insertion of the plug. An opening is configured to receive the plug, which is formed on the front face of the housing and connected to the cutout so that a plug is received by the opening. A distance from the upper face to the lower face of the housing is approximately equal to a diameter of the plug.
Public/Granted literature
- US20160141779A1 JACK SOCKET AND ELECTRONIC DEVICE Public/Granted day:2016-05-19
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