Invention Grant
- Patent Title: Radio frequency connector and assembly having micro-via radial interconnect
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Application No.: US15200695Application Date: 2016-07-01
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Publication No.: US09761972B2Publication Date: 2017-09-12
- Inventor: Philip Beucler , Daniel Coolidge , Darryl J. McKenney , Kevin Jorczak
- Applicant: MERCURY SYSTEMS, INC.
- Applicant Address: US MA Andover
- Assignee: MERCURY SYSTEMS, INC.
- Current Assignee: MERCURY SYSTEMS, INC.
- Current Assignee Address: US MA Andover
- Agency: Nelson Mullins Riley & Scarborough LLP
- Main IPC: H01R9/05
- IPC: H01R9/05 ; H01R12/71 ; H01R12/58 ; H01R13/652 ; H05K1/18 ; H05K3/34 ; H05K1/02 ; H05K1/11

Abstract:
An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.
Public/Granted literature
- US20170149156A1 RADIO FREQUENCY CONNECTOR AND ASSEMBLY HAVING MICRO-VIA RADIAL INTERCONNECT Public/Granted day:2017-05-25
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