- Patent Title: Printed circuit board, electronic device, and manufacturing method
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Application No.: US15066244Application Date: 2016-03-10
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Publication No.: US09763331B2Publication Date: 2017-09-12
- Inventor: Yoshiyuki Hiroshima , Naoki Nakamura , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama , Tetsuro Yamada , Kohei Choraku
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2015-085722 20150420
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/18 ; H05K3/30 ; H05K3/46
Abstract:
A printed circuit board includes: a first electrode made of a tubular electric conductor formed on an inner wall of a first hole formed in the printed circuit board; a dielectric body disposed inside the first electrode; and a second electrode made of a tubular electric conductor formed on an inner wall of a second hole extending through the dielectric body, the second electrode having a center axis concentric with the first electrode.
Public/Granted literature
- US20160309593A1 PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD Public/Granted day:2016-10-20
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