Invention Grant
- Patent Title: Apparatus for assembly of microelectronic devices
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Application No.: US14088725Application Date: 2013-11-25
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Publication No.: US09763370B2Publication Date: 2017-09-12
- Inventor: Murat Okandan , Gregory N. Nielson , Jose Luis Cruz-Campa , Judith Maria Lavin , Paul J. Resnick
- Applicant: National Technology & Engineering Solutions of Sandia, LLC
- Applicant Address: US NM Albuquerque
- Assignee: National Technology & Engineering Solutions of Sandia, LLC
- Current Assignee: National Technology & Engineering Solutions of Sandia, LLC
- Current Assignee Address: US NM Albuquerque
- Agent Martin I. Finston
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H01L21/67 ; B65G47/84 ; H05K3/30 ; H01L21/20 ; B65G47/86 ; H01L21/677 ; H01L21/673 ; H01L23/00 ; H01L31/0224 ; H01L31/05 ; H01L31/068 ; H01L31/18
Abstract:
An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.
Public/Granted literature
- US20140259633A1 PRINTED CRYSTALLINE MICROELECTRONIC DEVICES Public/Granted day:2014-09-18
Information query
