A method bonds a first member to a second member. The method provides a first member having a bonding surface. A second member is molded from a metal material so as to have a surface constructed and arranged to be bonded to the bonding surface. The surface of the second member is laser trimmed to remove material and to remove byproducts, resulting from molding the second member, from the surface of the second member to thereby define a clean, laser trimmed surface of the second member. A sealant is provided between and in contact with the bonding surface and the clean, laser trimmed surface. The sealant is permitted to cure to thereby bond the first member to the second member.