Invention Grant
- Patent Title: Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module
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Application No.: US14761697Application Date: 2014-01-20
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Publication No.: US09764416B2Publication Date: 2017-09-19
- Inventor: Toshiyuki Nagase , Yoshiyuki Nagatomo , Nobuyuki Terasaki
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2013-009199 20130122; JP2013-216783 20131017
- International Application: PCT/JP2014/050934 WO 20140120
- International Announcement: WO2014/115677 WO 20140731
- Main IPC: H05K1/00
- IPC: H05K1/00 ; B23K20/02 ; H01L23/373 ; H01L23/40 ; H01L23/473 ; B23K101/40 ; B23K103/10 ; B23K103/12 ; B23K103/18 ; B23K103/00
Abstract:
The power module substrate includes a circuit layer that is formed on a first surface of a ceramic substrate, and a metal layer that is formed on a second surface of the ceramic substrate, in which the metal layer has a first aluminum layer that is bonded to the second surface of the ceramic substrate and a first copper layer that is bonded to the first aluminum layer by solid-phase diffusion bonding.
Public/Granted literature
- US20150366048A1 POWER MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE Public/Granted day:2015-12-17
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