Invention Grant
- Patent Title: Liquid ejection head substrate and liquid ejection head
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Application No.: US15188571Application Date: 2016-06-21
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Publication No.: US09764550B2Publication Date: 2017-09-19
- Inventor: Koichi Ishida , Shintaro Kasai , Yoshiyuki Nakagawa , Akiko Saito , Takatsugu Moriya , Tatsuya Yamada , Shuzo Iwanaga
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A. Inc., IP Division
- Priority: JP2015-128154 20150625
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A liquid ejection head substrate includes a heating resistor array including a plurality of heating resistors and a protective film covering at least one of the heating resistors. The liquid ejection head substrate further includes a supply opening array and an electrode. The supply opening array is disposed on a side of a surface of the liquid ejection head substrate on which the protective film is provided. The supply opening array includes a plurality of supply openings through which a liquid is supplied arranged in a direction along the heating resistor array. The electrode is disposed on the side of the surface in a space between the supply openings adjacent to each other in a direction along the supply opening array. The electrode is configured such that a voltage is applied between the electrode and the protective film.
Public/Granted literature
- US20160375685A1 LIQUID EJECTION HEAD SUBSTRATE AND LIQUID EJECTION HEAD Public/Granted day:2016-12-29
Information query
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