Invention Grant
- Patent Title: Multi-level micromechanical structure
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Application No.: US15147197Application Date: 2016-05-05
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Publication No.: US09764942B2Publication Date: 2017-09-19
- Inventor: Antti Iihola , Altti Torkkeli , Ville-Pekka Rytkönen , Matti Liukku
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto
- Agency: Squire Patton Boggs (US) LLP
- Priority: FI20155352 20150515; FI20155843 20151116
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00 ; G01P15/125 ; G01P15/18 ; G01C19/56

Abstract:
The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a second surface of the device layer.
Public/Granted literature
- US20160332864A1 MULTI-LEVEL MICROMECHANICAL STRUCTURE Public/Granted day:2016-11-17
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