- Patent Title: Semiconductor arrangement with one or more semiconductor columns
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Application No.: US14287155Application Date: 2014-05-26
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Publication No.: US09764950B2Publication Date: 2017-09-19
- Inventor: Jean-Pierre Colinge , Ta-Pen Guo , Chih-Hao Wang , Carlos H. Diaz
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; B82Y10/00 ; B82Y40/00 ; H01L29/66 ; H01L29/775 ; H01L29/06 ; H01L21/308 ; H01L29/423
Abstract:
A semiconductor arrangement includes a substrate region and a first semiconductor column projecting from the substrate region. The semiconductor arrangement includes a second semiconductor column projecting from the substrate region and adjacent the first semiconductor column. The second semiconductor column is separated a first distance from the first semiconductor column along a first axis. The semiconductor arrangement includes a third semiconductor column projecting from the substrate region and adjacent the first semiconductor column. The third semiconductor column is separated a second distance from the first semiconductor column along a second axis that is substantially perpendicular to the first axis. The second distance is different than the first distance.
Public/Granted literature
- US20150048442A1 SEMICONDUCTOR ARRANGEMENT WITH ONE OR MORE SEMICONDUCTOR COLUMNS Public/Granted day:2015-02-19
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