Invention Grant
- Patent Title: Three-dimension formation composition, method of manufacturing three-dimensional structure, and three-dimensional structure
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Application No.: US15112050Application Date: 2015-06-30
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Publication No.: US09765193B2Publication Date: 2017-09-19
- Inventor: Koki Hirata , Hiroshi Fukumoto , Shinichi Kato , Chigusa Sato
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2014-136177 20140701; JP2015-080919 20150410
- International Application: PCT/JP2015/003290 WO 20150630
- International Announcement: WO2016/009602 WO 20160121
- Main IPC: B29C67/00
- IPC: B29C67/00 ; B33Y10/00 ; B33Y70/00 ; C08J5/00 ; B33Y80/00 ; B33Y40/00 ; C08J3/00 ; C08J3/20 ; B29K105/16 ; C08K3/36 ; C08K7/26

Abstract:
There are provided a method of manufacturing a three-dimensional structure, and three-dimension formation composition, by each which a three-dimensional structure can be manufactured with high dimensional accuracy, and provided a three-dimensional structure manufactured with high dimensional accuracy.There is provided a method of manufacturing a three-dimensional structure, in which the three-dimensional structure is manufactured by laminating a layer, the method including: forming the layer using a three-dimension formation composition containing particles, a binding resin, and a water-based solvent; removing the water-based solvent from the layer by heating the layer; and applying a binding solution containing a binder to the layer, in which the binding resin has an ammonium salt of a carboxyl group as a functional group.
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