Invention Grant
- Patent Title: Polymer microparticle-dispersed resin composition and method for producing same
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Application No.: US13997745Application Date: 2011-12-28
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Publication No.: US09765207B2Publication Date: 2017-09-19
- Inventor: Yoshio Furukawa
- Applicant: Yoshio Furukawa
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-000776 20110105; JP2011-240879 20111102
- International Application: PCT/JP2011/080380 WO 20111228
- International Announcement: WO2012/093631 WO 20120712
- Main IPC: C08L83/00
- IPC: C08L83/00 ; C08L19/02 ; C08J5/24 ; C08L63/00 ; C08J3/00 ; C08L9/10 ; C08L13/02

Abstract:
The present invention provides a means for improving the elastic modulus (rigidity), heat resistance, toughness, and impact resistance of a resin to provide these properties in a good balance. The present invention provides a polymer microparticle-dispersed resin composition containing 100 parts by weight of a resin and 0.1 to 150 parts by weight of polymer microparticles each containing at least two layers: a crosslinked polymer layer and a coating polymer layer, the resin composition having a particle dispersity of the polymer microparticles in the resin of not lower than 50%, the crosslinked polymer layer including 50% by weight to 99% by weight of at least one monomer having a Tg, as determined as a homopolymer, of not lower than 0° C., and 50% by weight to 1% by weight of at least one monomer having a Tg, as determined as a homopolymer, of lower than 0° C.
Public/Granted literature
- US20130310484A1 POLYMER MICROPARTICLE-DISPERSED RESIN COMPOSITION AND METHOD FOR PRODUCING SAME Public/Granted day:2013-11-21
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