One-component, solvent-free organosiloxane composition for application to printed circuit boards by means of a cross-cut nozzle
Abstract:
One-component, solvent-free organosiloxane composition comprising a) a linear or branched polyorganosiloxane containing at least two alkenyl or alkynyl groups, as component A; b) a linear or branched polyorganosiloxane containing at least 3 Si—H groups, as component B; c) a hydrosilylation catalyst as component C; d) an alkynol of the general formula (I) wherein R1, R2, R3 are selected independently of one another from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-alkyl; or R1 is selected from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-cycloalkyl, and R2, R3 are bonded together and form a 3- to 8-membered ring which can be substituted by one or more C1-C3-alkyl groups, as component D; and e) a fumed silica as component E.
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