Invention Grant
- Patent Title: Electroplated plastic chassis for electronic device
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Application No.: US14499172Application Date: 2014-09-27
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Publication No.: US09765439B2Publication Date: 2017-09-19
- Inventor: David Pidwerbecki , Mark E. Sprenger , Songnan Yang , Kwan Ho X. Lee
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Main IPC: H01Q7/00
- IPC: H01Q7/00 ; C25D7/00 ; H05K1/02 ; H05K1/16 ; H05K3/00 ; H05K3/18 ; C25D5/02 ; C25D5/10 ; C25D5/48
Abstract:
In one example an electronic device comprises a controller and a chassis comprising a polymer layer, a first metallic layer deposited on a first side of the polymer layer, and a second metallic layer deposited on a second side of the polymer layer, wherein at least one of the first metallic layer or the second metallic layer comprises an electrically functional integrated structure. Other examples may be described.
Public/Granted literature
- US20160095229A1 ELECTROPLATED PLASTIC CHASSIS FOR ELECTRONIC DEVICE Public/Granted day:2016-03-31
Information query
