Invention Grant
- Patent Title: Heat-pump system with refrigerant charge diagnostics
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Application No.: US14244967Application Date: 2014-04-04
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Publication No.: US09765979B2Publication Date: 2017-09-19
- Inventor: Fadi M. Alsaleem , Gregg M. Hemmelgarn
- Applicant: Emerson Electric Co.
- Applicant Address: US OH Sidney
- Assignee: Emerson Climate Technologies, Inc.
- Current Assignee: Emerson Climate Technologies, Inc.
- Current Assignee Address: US OH Sidney
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: B60H1/00
- IPC: B60H1/00 ; G05D23/00 ; F25B49/00 ; G01K13/00 ; F24D19/10 ; F25B13/00

Abstract:
A heat-pump circuit may include an indoor heat exchanger, an outdoor heat exchanger, a compressor adapted to circulate a working fluid between the indoor and outdoor heat exchangers, and an expansion device disposed between the indoor and outdoor heat exchangers. A monitor for the heat-pump system may include a return-air temperature sensor, a supply-air temperature sensor, and a processor. The return-air temperature sensor may be adapted to measure a first air temperature of air upstream of the indoor heat exchanger. The supply-air temperature sensor may be adapted to measure a second air temperature of air downstream of the indoor heat exchanger. The processor may be in communication with the return-air temperature sensor and the supply-air temperature sensor. The processor may be programmed to determine a working-fluid-charge condition of the heat-pump system based on the first and second air temperatures.
Public/Granted literature
- US20140299289A1 HEAT-PUMP SYSTEM WITH REFRIGERANT CHARGE DIAGNOSTICS Public/Granted day:2014-10-09
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