In a temperature sensitive element, a covering member containing a glass as a main component and having a thermal expansion coefficient smaller than that of output lines is provided on pads to cover at least portions of output lines located on the pads. The pads are formed of a glass-based material which contains, as main components, a metal and a glass having a thermal expansion coefficient smaller than that of a ceramic substrate, and the thermal expansion coefficient of the pads is set to be smaller than that of the output lines. Accordingly, in the case where the temperature sensitive element is exposed to a temperature change between a high temperature and ordinary temperature, compressive stress can be applied to the output lines by the covering member and the pads. Thus, the fixing force between the output lines and the pads can be increased.