Invention Grant
- Patent Title: Positive-type resist composition, method for forming resist pattern, photo-reactive quencher, and polymeric compound
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Application No.: US15186044Application Date: 2016-06-17
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Publication No.: US09766541B2Publication Date: 2017-09-19
- Inventor: Hiroto Yamazaki , Yoshitaka Komuro , Masatoshi Arai , Daisuke Kawana , Kenta Suzuki , Tatsuya Fujii
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2015-129169 20150626
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/20 ; G03F7/32 ; C08F216/10 ; G03F7/038 ; H01L21/027 ; C07C65/10 ; C07C309/06 ; C07C309/12 ; C07C309/19 ; C07C381/12

Abstract:
A positive-type resist composition which generates an acid upon exposure and whose solubility in an alkali developing solution increases under the action of an acid, the composition including a base material component whose solubility in an alkali developing solution increases under the action of an acid; and a compound represented by the following general formula (m0): Z01 to Z04 each independently represent a substituent having electron withdrawing properties, Rb21 and Rb22 each independently represent an alkyl group, an alicyclic hydrocarbon group which may have a substituent, or a hydroxyl group, Rb1 represents an aryl group which may have a substituent, an alkyl group, or an alkenyl group, n1 and n2 represent an integer of 0 to 3, and X0− represents an organic anion.
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