Invention Grant
- Patent Title: FinFET capacitor circuit
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Application No.: US14856873Application Date: 2015-09-17
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Publication No.: US09768161B2Publication Date: 2017-09-19
- Inventor: Rongtian Zhang , Lew Chua-Eoan , Shiqun Gu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/66 ; H01L21/84 ; H01L27/12 ; H01L27/13 ; H01L49/02 ; H01L27/088 ; H01L21/8234

Abstract:
A capacitor includes a semiconductor substrate. The capacitor also includes a first terminal having a fin disposed on a surface of the semiconductor substrate. The capacitor further includes a dielectric layer disposed onto the fin. The capacitor still further includes a second terminal having a FinFET compatible high-K metal gate disposed proximate and adjacent to the fin.
Public/Granted literature
- US20160013180A1 FinFET CIRCUIT Public/Granted day:2016-01-14
Information query
IPC分类: