Invention Grant
- Patent Title: Integrated circuit and method of testing
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Application No.: US14496265Application Date: 2014-09-25
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Publication No.: US09768762B2Publication Date: 2017-09-19
- Inventor: Jinn-Yeh Chien
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G01R31/02
- IPC: G01R31/02 ; H03K5/26 ; G01R31/317

Abstract:
An integrated circuit includes a first circuit and a test circuit. The test circuit is configured to test the timing of a first circuit. The first circuit includes a plurality of flip-flops and a plurality of data paths. Each data path of the plurality of data paths is connected to one or more of the plurality of flip-flops. The test circuit includes a plurality of loopback paths, a controller, a multiplexer connected to the plurality of loopback paths and a counter connected to the multiplexer. The controller is configured to select a path from the plurality of loopback paths and the plurality of data paths. The multiplexer is configured to selectively output a first signal including an oscillation frequency. The first signal is applied to the selected path and the counter is configured to measure the oscillation frequency of the first signal.
Public/Granted literature
- US20160091560A1 INTEGRATED CIRCUIT AND METHOD OF TESTING Public/Granted day:2016-03-31
Information query