Invention Grant
- Patent Title: Sound transducer acoustic back cavity system
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Application No.: US15136002Application Date: 2016-04-22
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Publication No.: US09769559B2Publication Date: 2017-09-19
- Inventor: Shengrong Shi
- Applicant: Nokia Corporation
- Applicant Address: FI Espoo
- Assignee: Nokia Technologies Oy
- Current Assignee: Nokia Technologies Oy
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R1/28 ; H04M1/03 ; H04R31/00

Abstract:
An apparatus including a housing member and an airflow spreader. The housing member includes an acoustic back cavity for a sound transducer and at least two second cavities in the housing member spaced from the acoustic back cavity. The airflow spreader is connected to the housing member. The airflow spreader includes a conduit system connecting the acoustic back cavity directly with each of the at least two second cavities through the airflow spreader.
Public/Granted literature
- US20160241950A1 Sound Transducer Acoustic Back Cavity System Public/Granted day:2016-08-18
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