Invention Grant
- Patent Title: Printed circuit board and manufacturing method therefor
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Application No.: US14732309Application Date: 2015-06-05
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Publication No.: US09769921B2Publication Date: 2017-09-19
- Inventor: Yang Yoon Choi , Ok Ky Beak
- Applicant: Tyco Electronics AMP Korea Ltd
- Applicant Address: KR Gyungsangbuk-Do
- Assignee: Tyco Electronics AMP Korea Ltd.
- Current Assignee: Tyco Electronics AMP Korea Ltd.
- Current Assignee Address: KR Gyungsangbuk-Do
- Agency: Barley Snyder
- Priority: KR10-2012-0141576 20121207
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09 ; H05K1/11 ; H05K3/06 ; H05K3/46 ; H05K3/42 ; C25D5/02 ; C23C18/16 ; C23C18/54 ; H05K3/38 ; H05K3/00
Abstract:
A printed circuit board has a double-sided substrate with an insulation layer, a bonding member, a base layer of an aluminum material, and a circuit pattern; a second insulation layer; a second bonding member; a second base layer; a through hole; a zinc substitution layer; a plating layer; and a second circuit pattern.
Public/Granted literature
- US20150271917A1 Printed Circuit Board and Manufacturing Method Therefor Public/Granted day:2015-09-24
Information query
