Invention Grant
- Patent Title: Breakout via system
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Application No.: US14694759Application Date: 2015-04-23
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Publication No.: US09769926B2Publication Date: 2017-09-19
- Inventor: Kevin Warren Mundt , Sandor Farkas , Bhyrav Mutnury
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Haynes and Boone, LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; G06F1/20 ; G06F1/18

Abstract:
A circuit board includes a board base with a first surface and a second surface that is located opposite the first surface. A plurality of first coupling pads are located on the first surface of the board base. A plurality of second coupling pads are located on the second surface of the board base. The first coupling pads and the second coupling pads define a coupling pad footprint. A breakout via system is included in the board base. The breakout via system includes a plurality of primary signal vias that are located in the board base and outside of the coupling pad footprint, a plurality of first primary signal via connections that extend between the primary signal vias and the plurality of first coupling pads, and a plurality of second primary signal via connections that extend between the primary signal vias and the plurality of second coupling pads.
Public/Granted literature
- US20160316562A1 BREAKOUT VIA SYSTEM Public/Granted day:2016-10-27
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