Invention Grant
- Patent Title: Covering device for a contacting portion of a printed circuit board, control system for a mechatronic module and method for assembling a control system
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Application No.: US14385093Application Date: 2013-02-01
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Publication No.: US09769945B2Publication Date: 2017-09-19
- Inventor: Josef Loibl , Herbert Wallner , Roland Friedl
- Applicant: ZF Friedrichshafen AG
- Applicant Address: DE Friedrichshafen
- Assignee: ZF Friedrichshafen AG
- Current Assignee: ZF Friedrichshafen AG
- Current Assignee Address: DE Friedrichshafen
- Agency: Brinks Gilson & Lione
- Priority: DE102012204004 20120314
- International Application: PCT/EP2013/051993 WO 20130201
- International Announcement: WO2013/135429 WO 20130919
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K5/03 ; H01R13/52 ; H05K5/00 ; H01R43/20 ; H05K7/14 ; H01R29/00 ; H01R12/00 ; H01R13/62 ; H01R13/648 ; H01R12/50 ; H01R12/72 ; H01R13/6587 ; H01R12/58

Abstract:
A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element.
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