Invention Grant
- Patent Title: Refrigerating apparatus
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Application No.: US14395644Application Date: 2013-04-26
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Publication No.: US09769955B2Publication Date: 2017-09-19
- Inventor: Junichi Teraki , Akihiko Oguri
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2012-103724 20120427
- International Application: PCT/JP2013/002862 WO 20130426
- International Announcement: WO2013/161323 WO 20131031
- Main IPC: F25D23/12
- IPC: F25D23/12 ; H05K7/20 ; F24F1/24 ; F25B31/00 ; H01L23/473 ; H05K1/02 ; F25B13/00 ; H05K3/22 ; H05K3/30 ; H05K3/34

Abstract:
A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.
Public/Granted literature
- US20150082822A1 REFRIGERATING APPARATUS Public/Granted day:2015-03-26
Information query
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