Invention Grant
- Patent Title: Electronic circuit component mounting head
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Application No.: US14443721Application Date: 2012-11-21
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Publication No.: US09769969B2Publication Date: 2017-09-19
- Inventor: Koji Kawaguchi
- Applicant: FUJI MACHINE MFG. CO., LTD.
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2012/080164 WO 20121121
- International Announcement: WO2014/080473 WO 20140530
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04

Abstract:
An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.
Public/Granted literature
- US20150296668A1 ELECTRONIC CIRCUIT COMPONENT MOUNTING HEAD Public/Granted day:2015-10-15
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