An apparatus and method for feeding electronic components for insertion onto circuit boards, the apparatus comprising: a vibratory bowl configured for receiving electronic components and for lining up the electronic components onto a moveable conveyor, the vibratory bowl is configured for vibrating and guiding each of the electronic components towards an opening in the vibratory bowl where each of the electronic components is transferred to the conveyor; a component processing unit configured for checking operation of each of the electronic components lined up along the conveyor and for removing any defective electronic component failing the operation check; and a component feeder configured for transferring each of the electronic components that are non-defective to a machine for handling insertion of the electronic components onto circuit boards.