Invention Grant
- Patent Title: Method of manufacturing chemical mechanical polishing pads
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Application No.: US14993815Application Date: 2016-01-12
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Publication No.: US09770808B2Publication Date: 2017-09-26
- Inventor: Francis V. Acholla , Andrew Wank , Mark Gazze , Scott Chang , Jeff Tsai , William A. Heeschen , James David Tate , Leo H. Chiang , Swee-Teng Chin
- Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc. , Dow Global Technologies LLC
- Applicant Address: US DE Newark US MI Midland
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- Current Assignee Address: US DE Newark US MI Midland
- Agent Thomas S. Deibert
- Main IPC: B24D11/00
- IPC: B24D11/00 ; B24D18/00 ; B29C59/02 ; B24B37/22 ; B29C65/48 ; B26D7/10 ; G01N21/95 ; G01N21/88 ; G01N21/94 ; B29L31/00 ; B29L9/00 ; B29K75/00 ; B29K105/16 ; B29K479/00
Abstract:
A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.
Public/Granted literature
- US20170197295A1 METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING PADS Public/Granted day:2017-07-13
Information query
