Invention Grant
- Patent Title: Multi-dimensional component build system and process
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Application No.: US14541184Application Date: 2014-11-14
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Publication No.: US09770866B2Publication Date: 2017-09-26
- Inventor: Sergey Mironets , Agnes Klucha , Wendell V. Twelves, Jr. , Benjamin T. Fisk
- Applicant: United Technologies Corporation
- Applicant Address: US CT Hartford
- Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Hartford
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: B29C67/00
- IPC: B29C67/00 ; B23K15/00 ; B28B11/00 ; F02C7/00 ; B22F3/105 ; B33Y30/00 ; B29C35/08 ; B33Y10/00

Abstract:
An example multi-dimensional component building system includes a first chamber having at least one base disposed therein, a second chamber adjacent to and in fluid communication with the first chamber through a first door, and a third chamber adjacent to and in fluid communication with the second chamber through a second door. The second chamber is fluidly sealed from the first chamber if the first door is in a closed position. The second chamber is configured to receive the at least one base via a first transfer mechanism if the fluid parameters of the first chamber are approximately equal to the fluid parameters of the second chamber. The second chamber includes a directed heat source and a build-up material configured to form a component on the at least one base by melting or sintering. The third chamber is fluidly sealed from the second chamber if the first door is in a closed position. The third chamber is configured to receive the at least one base, having a formed component disposed thereon, via a second transfer mechanism if the second door is in an open position. The fluid parameters of the second chamber are not substantially affected by fluid communication with the first chamber or the third chamber.
Public/Granted literature
- US20150069668A1 MULTI-DIMENSIONAL COMPONENT BUILD SYSTEM AND PROCESS Public/Granted day:2015-03-12
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