Invention Grant
- Patent Title: Liquid ejecting apparatus and control method and program of liquid ejecting apparatus
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Application No.: US14859994Application Date: 2015-09-21
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Publication No.: US09770905B2Publication Date: 2017-09-26
- Inventor: Kyohei Date
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2014-193553 20140924
- Main IPC: B41J29/38
- IPC: B41J29/38 ; B41J2/045 ; B41J2/14 ; B41J2/145 ; B41J2/21

Abstract:
A liquid ejecting apparatus includes a wiring substrate; and a liquid ejecting head, in which the liquid ejecting head includes a plurality of electrodes, an ejecting unit, and a non-ejecting unit, the wiring substrate is connected to the plurality of electrodes, the ejecting unit includes a driven element which is displaced due to a signal waveform applied to an electrode which is provided so as to correspond to at least one of the plurality of electrodes, a pressure chamber, and nozzles, the non-ejecting unit is provided so as to correspond to at least another electrode among the plurality of electrodes, and does not include at least one of the nozzle, the driven element, and the pressure chamber, and the signal waveform which is applied to an electrode which corresponds to the non-ejecting unit is designated by a dummy signal in the printing data.
Public/Granted literature
- US20160082724A1 LIQUID EJECTING APPARATUS AND CONTROL METHOD AND PROGRAM OF LIQUID EJECTING APPARATUS Public/Granted day:2016-03-24
Information query
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